Aluminum Nitride Substrate

Aluminum Nitride ceramics have excellent comprehensive properties, and are a new generation of advanced ceramics that have attracted wide attention in recent years. They have the advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching with silicon and non-toxicity, making them ideal materials for high-density, high-power and high-speed integrated circuit substrates and packaging.

Hot pressing and isostatic pressing are suitable for preparing high-performance chip aluminum nitride, but the cost is high and the production efficiency is relatively low. The tape casting method has become the main forming process of aluminum nitride ceramic substrate for electronic industry.

NCE can provide Aluminum Nitride (AlN) substrate as required. Various sizes can be customized. Please contact us for the RFQ.

Typical Application of Aluminum Nitride (AlN):

High-power circuits, RF and microwave circuits, GaAs crystal crucible, Al evaporation pan, MHD power generation equipment, communication devices, led packages, power electronics devices, semiconductor refrigeration devices, high-power integrated circuits, new energy vehicles, etc.

Features:

1. High thermal conductivity, more than 5 times that of alumina ceramics
2. Lower thermal expansion coefficient and close to silicon chip
3. Lower dielectric constant
4. Excellent insulation
5. Excellent mechanical properties, flexural strength higher than Al₂O₃ and BeO ceramics, can be sintered at atmospheric pressure
6. Heat resistant and chemically resistant
7. Non-toxic

Square:

Width & Length: 2” x 2”, 3” x 3”, 4” x 4”, 4.5” x 4.5”
Thickness: 0.385 mm, 0.5 mm, 0.635 mm, 0.75 mm, 1 mm

Rectangle:

Width & Length: 4” x 5”, 5.5” x 7.5”
Thickness: 0.385 mm, 0.635 mm, 1 mm

Round:

Diameter (mm): 19, 20, 26, 30, 35, 40, 45, 50, 52, 60
Thickness (mm): 1.5 mm, 2 mm

1. According to customer needs, we can do surface metallization gold plating, silver plating, copper plating and other metals, with better heat conduction effect.
2. Conventional ceramic products can be polished (single and double-sided polishing).
3. Other processing methods can be processed according to the customer’s drawing requirements.

1. Mold processing: all products except laser processing need mold processing.
2. Laser processing products: according to the requirements of customers, laser products (aluminum nitride, aluminum oxide, zirconia, etc.) are used for marking, drilling and slotting. The minimum hole diameter of laser drilling is 0.05 mm, and the laser cutting thickness is less than 2 mm. The product has high processing accuracy and good repeatability.

Inquiries and orders should include the following information:

1. Dimensions or drawings
2. Quantity

Standard Packing: Sealed bags in carton boxes. Special package is available on request.